層數:10
特殊工藝:阻抗
表面處理:沉金
材料:FR4 TG170
外層線寬/線距:9/8mil
內層線寬/線距:6.5/6.5mil
板厚:4.0mm
最小孔徑:0.5mm
Product name: 10 Layer High TG ENIG Impedance Control PCB
Number of layers: 10
Surface finish: ENIG
Base material: High TG FR4?
Outer Layer W/S: 9/8mil
Inner layer W/S: 6.5/6.5mil
Thickness: 4.0mm
Min. hole diameter: 0.5mm
Special process: Impedance Control